HARWIN 0.1mm Grounding Contact
About The 0 x 1.0 x 0
HARWIN 0.1mm Grounding Contact, Material: Beryllium Copper, Series: S70, Current Rating: 6A, Fixing Method: Surface Mount, Contact Plating: Gold, Dimensions: 2.0 x 1.0 x 0.1mm, MPN: S70-220101045R
Electronic Components & Power & Connectors > ESD Control & Cleanroom & PCB Prototyping > Prototyping Boards > Grounding Contacts
HARWIN 0.1mm Grounding Contact
Electronic Components & Power & Connectors > ESD Control & Cleanroom & PCB Prototyping > Prototyping Boards > Grounding Contacts
Specifications of HARWIN 0.1mm Grounding Contact | |
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Electronic Components & Power & Connectors
ESD Control & Cleanroom & PCB Prototyping
Prototyping Boards
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