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CIF DZ1122, Single-Sided Copper Clad Board FR4 With 35μm Copper Thick, 220 X 100 X 1.6mm

About The CIF DZ1122, Single-Sided Copper Clad Board FR4 With 35μm Copper Thick, 220 x 100 x 1.6mm, Base Material: Epoxy Glass Fabric Laminate, Board Type: Photoresist Board, Copper Thickness: 35µm, Length: 220mm, Thickness: 100mm

CIF DZ1122, Single-Sided Copper Clad Board FR4 With 35μm Copper Thick, 220 x 100 x 1.6mm, Base Material: Epoxy Glass Fabric Laminate, Board Type: Photoresist Board, Copper Thickness: 35µm, Length: 220mm, Thickness: 100mm

Electronic Components & Power & Connectors > ESD Control & Cleanroom & PCB Prototyping > Prototyping Boards > Copper Clad Boards

CIF DZ1122, Single-Sided Copper Clad Board FR4 With 35μm Copper Thick, 220 X 100 X 1.6mm

Electronic Components & Power & Connectors > ESD Control & Cleanroom & PCB Prototyping > Prototyping Boards > Copper Clad Boards

Specifications of CIF DZ1122, Single-Sided Copper Clad Board FR4 With 35μm Copper Thick, 220 X 100 X 1.6mm

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CIF DZ1122, Single-Sided Copper Clad Board FR4 With 35μm Copper Thick, 220 X 100 X 1.6mm
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