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E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

About The E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A, Row Width: 7

E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Contact Material: Beryllium Copper, Housing Material: PBT, Maximum Operating Temperature: +125°C, Minimum Operating Temperature: -55°C, MPN: POS-628-S035-55

Electronic Components & Power & Connectors > Connectors > IC Sockets & Adapters > DIL Sockets

E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

Electronic Components & Power & Connectors > Connectors > IC Sockets & Adapters > DIL Sockets

Specifications of E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

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E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A
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    • E-TEC 2.54mm Pitch Vertical 28 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 1A

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