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E-TEC 2.54mm Pitch Vertical 18 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

About The .54mm Pitch Vertical 18 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A, Row Width: 7

E-TEC 2.54mm Pitch Vertical 18 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 22.8mm, Contact Material: Beryllium Copper, Housing Material: PBT, Maximum Operating Temperature: +125°C, MPN: POS-318-S001-95 X22

Electronic Components & Power & Connectors > Connectors > IC Sockets & Adapters > DIL Sockets

E-TEC 2.54mm Pitch Vertical 18 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

Electronic Components & Power & Connectors > Connectors > IC Sockets & Adapters > DIL Sockets

Specifications of E-TEC 2.54mm Pitch Vertical 18 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A

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E-TEC 2.54mm Pitch Vertical 18 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A
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