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TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A

About The 57mm, Depth: 17.24mm, Termination Method: Solder, Contact Plating: Gold, Length: 35

TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Gold, Length: 35.56mm, Width: 4.57mm, Depth: 17.78mm, Dimensions: 35.56 x 4.57 x 17.78mm, Contact Material: Beryllium Copper, MPN: 9-1437539-2

Electronic Components & Power & Connectors > Connectors > IC Sockets & Adapters > DIL Sockets

TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A

Electronic Components & Power & Connectors > Connectors > IC Sockets & Adapters > DIL Sockets

Specifications of TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A

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TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A
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