TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Gold, Length: 35.56mm, Width: 4.57mm, Depth: 17.78mm, Dimensions: 35.56 x 4.57 x 17.78mm, Contact Material: Beryllium Copper, MPN: 9-1437539-2
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TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A
Specifications of TE Connectivity 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 3A | |
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Instock | instock |
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