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Samtec TFM Series Right Angle Through Hole PCB Header, 30 Contact(s), 1.27mm Pitch, 2 Row(s), Shrouded

About The 0A, Voltage Rating: 350.27mm Pitch, 2 Row(s), Shrouded, Connector System: Board to Board, Wire to Board, Termination Method: Solder, Contact Material: Phosphor Bronze, Contact Plating: Gold, Current Rating: 5

Samtec TFM Series Right Angle Through Hole PCB Header, 30 Contact(s), 1.27mm Pitch, 2 Row(s), Shrouded, Connector System: Board to Board, Wire to Board, Termination Method: Solder, Contact Material: Phosphor Bronze, Contact Plating: Gold, Current Rating: 5.0A, Voltage Rating: 350.0 V, MPN: TFM-115-01-L-D-RA

Electronic Components & Power & Connectors > Connectors > PCB Connectors & Wire Housings > PCB Headers

Samtec TFM Series Right Angle Through Hole PCB Header, 30 Contact(s), 1.27mm Pitch, 2 Row(s), Shrouded

Electronic Components & Power & Connectors > Connectors > PCB Connectors & Wire Housings > PCB Headers

Specifications of Samtec TFM Series Right Angle Through Hole PCB Header, 30 Contact(s), 1.27mm Pitch, 2 Row(s), Shrouded

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Samtec TFM Series Right Angle Through Hole PCB Header, 30 Contact(s), 1.27mm Pitch, 2 Row(s), Shrouded
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Rating :- 9.21 /10
Votes :- 9