Bostik Bond-Flex 100HMA White Sealant Non-Slump Paste 300 Ml Cartridge

54mm Pitch, 1 Row(s), Shrouded, Connector System: Wire to Board, Termination Method: Solder, Contact Material: Brass, Contact Plating: Gold, Current Rating: 3A, MPN: 1591-7020.

9V, Number of Elements per Chip: 1, Diode Technology: Silicon Junction, Peak Reverse Recovery Time: 25ns, Peak Non-Repetitive Forward Surge Current: 50A.

68CPLA-C30-T4, Ceramic Resonator, 3.1%, Frequency Stability: ±0.

57mm, Length: 19.3 x 6.3mm.

0 V ac, 550.

Infineon TLD700216ESXUMA1 LED Driver IC, 28 V 76.

Bostik Bond-Flex 100HMA White Sealant Non-Slump Paste 300 ml Cartridge, Sealant Type: Silicone Sealant, Application: Exterior, Sealing, Minimum Operating Temperature: -50°C, Maximum Operating Temperature: +180°C, Chemical Type: Acetoxy, Elastomer, Physical Properties: Acetoxy Cure, High Modulus, Cure Time: 24 (2 mm h @ 23 °C), Operating Temperature Range: -50 → +180 °C, MPN: 91363.

Schneider Electric Cable for Use with GV2ME, Accessory Type: Enclosure, Better World Product: Yes, Better World Verification: Green Premium, MPN: GV2MP03.

Bostik Bond-Flex 100HMA White Sealant Non-Slump Paste 300 ml Cartridge, Sealant Type: Silicone Sealant, Application: Exterior, Sealing, Minimum Operating Temperature: -50°C, Maximum Operating Temperature: +180°C, Chemical Type: Acetoxy, Elastomer, Physical Properties: Acetoxy Cure, High Modulus, Cure Time: 24 (2 mm h @ 23 °C), Operating Temperature Range: -50 → +180 °C, MPN: 91363.

Schneider Electric Cable for Use with GV2ME, Accessory Type: Enclosure, Better World Product: Yes, Better World Verification: Green Premium, MPN: GV2MP03.