Molex 1.9mm Pitch 3 Pair Backplane Connector, Female, Right Angle, 8 Column, 6 Row, 48 Way, 172730

3mm, Dimensions: 7 (Dia.

Molex 201196 Series Crimp Contact, For Use With: Spot-On Wire-to-Board Connector System, MPN: 201196-4150.

Molex 201196 Series Crimp Contact, Accessory Type: Terminal Position Assurance, For Use With: Spot-On Wire-to-Board Connector System, MPN: 201196-4040.

NXP LPC11U24FBD48/401, 32bit Cortex-M0 Microcontroller, LPC11U, 50MHz, 24 kB Flash, 48-Pin LQFP, Mounting Type: Surface Mount, RAM Size: 8 kB.

Samtec Board-To-Board Connector, Vita 57 XMC, 1, MPN: ASP-134487-01.

35 x 0.5mm², Maximum Wire Size (AWG): 15AWG, Minimum Wire Size (AWG): 22AWG, Termination Method: Crimp, Contact Material: Brass, Contact Plating: Tin, Insulation Material: Nylon, Overall Length: 22.TE Connectivity PIDG FASTON .

9mm Pitch 3 Pair Backplane Connector, Female, Right Angle, 8 Column, 6 Row, 48 Way, 172730, Housing Material: Thermoplastic, Contact Material: High Performance Alloy, Contact Plating: Gold over Nickel, Tin over Nickel, Current Rating: 750mA, Voltage Rating: 150 Vrms ac/dc, Termination Method: Through Hole, Maximum Operating Temperature: +85°C, Minimum Operating Temperature: -55°C, MPN: 172730-1138.Molex 1.

8mm Pitch, Solder Termination, Type: Rugged High-Speed Socket Strip, Body Orientation: Vertical, Current Rating: 2.0-S-DV-K-TR.

9mm Pitch 3 Pair Backplane Connector, Female, Right Angle, 8 Column, 6 Row, 48 Way, 172730, Housing Material: Thermoplastic, Contact Material: High Performance Alloy, Contact Plating: Gold over Nickel, Tin over Nickel, Current Rating: 750mA, Voltage Rating: 150 Vrms ac/dc, Termination Method: Through Hole, Maximum Operating Temperature: +85°C, Minimum Operating Temperature: -55°C, MPN: 172730-1138.Molex 1.

Samtec ERF8 Series Straight Surface Mount PCB Socket, 20-Contact, 2-Row, 0.8mm Pitch, Solder Termination, Type: Rugged High-Speed Socket Strip, Body Orientation: Vertical, Current Rating: 2.