Fortex 03-5109, Double-Sided Copper Clad Board FR4 With 35μm Copper Thick, 100 X 220 X 1.6mm

0°C, Maximum Operating Temperature: 105.

54mm Pitch, 1 Row(s), Shrouded, Connector System: Board to Board, Termination Method: Solder, Contact Material: Phosphor Bronze, Contact Plating: Tin, MPN: 828548-3.

5mm, Depth: 2mm, Height: 1.

5X30, Capacitance: 680µF, Dimensions: 12.

5mm, Lifetime: 5000h, Equivalent Series Resistance: 220mΩ, Leakage Current: 25 μA, Ripple Current: 340mArms.3 x 11mm, Minimum Operating Temperature: -40°C, Diameter: 6.3mm, Maximum Operating Temperature: +105°C, Lead Pitch: 2.CHEMI-CON 100μF Aluminium Electrolytic Capacitor 25V dc, Radial, Through Hole - EKY-250ELL101MF11D, Capacitance: 100µF, Dimensions: 6.

CHEMI-CON 2200μF Aluminium Electrolytic Capacitor 25V dc, Radial, Through Hole - EKY-250ELL222MK35S, Capacitance: 2200µF, Dimensions: 12.

8mm, Length: 58.45mm, MPN: 20835-849.nVent SCHROFF Aluminium Rack Panel, Width: 12.

Fortex 03-5109, Double-Sided Copper Clad Board FR4 With 35μm Copper Thick, 100 x 220 x 1.6mm, Base Material: Epoxy Glass Fabric Laminate, Board Type: Photoresist Board, Copper Thickness: 35 μm, 70µm, Length: 100mm, Thickness: 220mm.

45mm, MPN: 20835-849.8mm, Length: 58.

Fortex 03-5109, Double-Sided Copper Clad Board FR4 With 35μm Copper Thick, 100 x 220 x 1.6mm, Base Material: Epoxy Glass Fabric Laminate, Board Type: Photoresist Board, Copper Thickness: 35 μm, 70µm, Length: 100mm, Thickness: 220mm.