E-TEC 1.778mm Pitch Vertical 64 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A, Row Width: 19.05mm, Termination Method: Solder, Contact Plating: Gold, Tin, Length: 55.12mm, Depth: 1.7mm, Contact Material: Beryllium Copper, Housing Material: Polymer, Maximum Operating Temperature: +125°C, MPN: SDS-232-S075-95
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E-TEC 1.778mm Pitch Vertical 64 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A
Specifications of E-TEC 1.778mm Pitch Vertical 64 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A | |
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Instock | instock |
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