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CIF AAC20, Single-Sided Copper Clad Board FR4 With 35μm Copper Thick, 300 X 200 X 0.4mm

About The CIF AAC20, Single-Sided Copper Clad Board FR4 With 35μm Copper Thick, 300 x 200 x 0.4mm, Base Material: Epoxy Glass Fabric Laminate, Board Type: Photoresist Board, Number of Sides: 1, Copper Thickness: 35µm, Length: 300mm, Thickness: 200mm

CIF AAC20, Single-Sided Copper Clad Board FR4 With 35μm Copper Thick, 300 x 200 x 0.4mm, Base Material: Epoxy Glass Fabric Laminate, Board Type: Photoresist Board, Number of Sides: 1, Copper Thickness: 35µm, Length: 300mm, Thickness: 200mm

Electronic Components & Power & Connectors > ESD Control & Cleanroom & PCB Prototyping > Prototyping Boards > Copper Clad Boards

CIF AAC20, Single-Sided Copper Clad Board FR4 With 35μm Copper Thick, 300 X 200 X 0.4mm

Electronic Components & Power & Connectors > ESD Control & Cleanroom & PCB Prototyping > Prototyping Boards > Copper Clad Boards

Specifications of CIF AAC20, Single-Sided Copper Clad Board FR4 With 35μm Copper Thick, 300 X 200 X 0.4mm

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CIF AAC20, Single-Sided Copper Clad Board FR4 With 35μm Copper Thick, 300 X 200 X 0.4mm
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